PCB circuit boards

 OSP surface treatment process requirements for PCB circuit boards

OSP surface treatment process refers to the formation of a protective layer on the PCB board to prevent oxidation, in order to improve the reliability and stability of the product. Today, Linke Electronics will introduce in detail the OSP surface treatment process in PCB technology, including its process requirements, advantages, and other aspects.

The purpose of OSP surface treatment process

The main purpose of OSP surface treatment process is to form a protective layer on the PCB board to prevent oxidation, in order to improve the reliability and stability of the product. Meanwhile, the OSP surface treatment process can also reduce the impact on subsequent processes, such as drilling, assembly, etc.

The process flow of OSP surface treatment technology

The process flow of OSP surface treatment process is as follows:

(1) Cleaning: First, clean the PCB board to remove impurities such as oil and dust.
(2) Pre treatment: Pre treatment of PCB boards, including chemical cleaning, oxidation removal, etc.
(3) OSP solution treatment: Immerse the PCB board in the OSP solution, and by controlling the temperature, concentration, and time of the solution, form a protective layer on the surface of the PCB board to prevent oxidation.
(4) Drying: Remove the PCB board from the OSP solution and perform drying treatment to remove excess moisture and solvents.
(5) Inspection: Inspect the PCB board to ensure that its surface quality and performance meet the requirements.

Process requirements for OSP surface treatment process

(1) Cleaning requirements: Cleaning is the first step of OSP surface treatment process, and its cleaning effect directly affects the quality and performance of subsequent processes. Therefore, it is required that the cleaning agent used during the cleaning process should have good ability to remove oil and dust impurities, as well as low toxicity and environmental protection.

(2) Pre treatment requirements: Pre treatment is to remove the oxide layer and other impurities on the surface of the PCB board, in order to improve the effectiveness of the OSP surface treatment process. Therefore, chemical cleaning agents and oxidation removal agents should be used during the pretreatment process to achieve the expected results.

(3) OSP solution treatment requirements: OSP solution treatment is the core link of OSP surface treatment process, and its treatment effect directly affects the surface quality and performance of PCB boards. Therefore, it is required that the temperature, concentration, and time of OSP solution should be strictly controlled to ensure the formation of a uniform and dense protective layer on the surface of the PCB board.

(4) Drying requirements: Drying is to remove excess moisture and solvents from the surface of PCB boards to ensure their surface quality and performance. Therefore, suitable drying equipment and methods should be used during the drying process to ensure that the moisture and solvent content on the surface of the PCB board meets the required standards.

(5) Inspection requirements: Inspection is an important step in ensuring that the surface quality and performance of PCB boards meet the requirements. Therefore, it is required that inspectors should have good inspection skills and equipment, and strict inspection standards and methods should also be established to ensure product quality and performance.

The advantages of OSP surface treatment process

Improving reliability and stability: The OSP surface treatment process can form a protective layer on the surface of the PCB board to prevent oxidation, thereby improving the reliability and stability of the product.

Reduce the impact on subsequent processes: OSP surface treatment process can reduce the impact on subsequent processes such as drilling, assembly, etc., thereby improving process efficiency and quality.

Cost reduction: OSP surface treatment process has advantages such as low cost and environmental protection compared to other surface treatment processes, such as electroplating.

The application scope of OSP surface treatment technology

OSP surface treatment technology is widely used in the production and processing of PCB boards, including mobile phones, computers, automobiles, household appliances, and other fields. Meanwhile, OSP surface treatment technology can also be applied to the manufacturing and processing of other electronic products, such as smart wearable devices, IoT devices, etc.