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printed circuit manufacturing

printed circuit manufacturing

Guarantee of high reliability PCB: resin plugging process

Resin plugging is a process that uses resin materials to fill through holes or blind vias during the printed circuit manufacturing process.

The role of resin plugging

1. Enhance the mechanical strength and reliability of the circuit board

After filling the holes with resin material, it can effectively enhance the structural strength of the circuit board and reduce the hole wall cracking or delamination caused by thermal expansion or mechanical stress. Especially in HDI boards, resin plugging can prevent the hole wall deformation or fracture of multilayer boards during the thermal pressing process, thereby improving the overall reliability of the circuit board.

2. Prevent solder from flowing into the hole and causing a short circuit

During the soldering process, solder may flow into unfilled holes, causing problems such as short circuits or cold solder joints. Resin plug holes fill the holes to block the flow of solder, ensuring the stability and reliability of the soldering process, which is especially important in high-precision, high-density circuit boards.

3. Provide a flat surface for subsequent processing

After the resin plugging, the holes are completely filled and polished to make the circuit board surface smoother. This flat surface provides a better foundation for subsequent lamination, copper plating, solder mask coating and other processes, ensuring the interlayer bonding and surface quality of the circuit board.

4. Improve electrical performance and signal integrity

Resin materials have good insulation properties and can effectively reduce electromagnetic interference (EMI) and crosstalk during signal transmission. At the same time, resin plugging can reduce the air gap in the hole, reduce signal reflection and loss, and thus improve the electrical performance and signal integrity of the circuit board.

Application scenarios

HDI board: solve the problem of filling tiny holes (above 0.15mm) and improve the reliability of circuit boards.

Multilayer boards and thick boards: suitable for filling holes with high aspect ratios to avoid delamination and deformation problems.

Back-drilled boards: accurately fill back-drilled holes to ensure signal integrity and electrical performance.

Shijiazhuang Linke Electronics Tech Co.,Ltd's resin plugging machine, with its high vacuum technology, two plugging and one scraping process and efficient production capacity, has become an ideal choice for solving difficult plugging problems. Whether it is HDI PCB, multi-layer board or high-thickness board, Shijiazhuang Linke Electronics Tech Co.,Ltd can provide efficient and accurate resin plugging solutions to help customers improve product quality and production efficiency.

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