What are the conditions for the SMT placement machine to meet the requirements of the production line?

How to make sure the SMT process is good and fast? In fact, human and material factors each play a part. The human part is the coordination and cooperation of engineers, technicians, and operators; the object part is the SMT placement machine. This must consider the requirements of the production line for the placement machine. So, what are the conditions for the SMT placement machine to meet the requirements of the production line? Let us analyze it from the following aspects:

1.Component placement accuracy: High-precision placement plays a decisive role in controlling the accuracy of components, PCB circuit boards, and z-axis control, avoiding damage to components and PCB circuit boards, and improving production efficiency.

2. Appropriate pressure: The SMT pressure is very critical to the quality of the SMT. If the pressure is too small, the smaller component solder ends or pins will float on the solder paste, resulting in the solder paste not being attached to the components, resulting in device and pad offset during automatic production lines or reflow soldering;

If the pressure is too high, the solder paste will be squeezed to form a solder paste stick, and the structure of the component may be damaged.

3. SMT rate: Different placement machines need to be adjusted to the corresponding settings due to different parameters. If it is not adjusted in time, it may lead to poor component placement function.

The above are the conditions that the SMT placement machine must have to meet the requirements of the production line. I hope it will help you.